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Engineering & Technology · Heat Transfer & Thermal Management

Conduction, thermal resistance and material properties

Two panels contain the same metal sheet, but one assembly passes much less heat. The difference can lie in a neighboring layer or imperfect contact rather than the metal itself. A useful thermal model follows the complete path from one stated temperature boundary to another.

Thermodynamics & Energy Systems provides state, energy, heat and boundary vocabulary. Material Structure, Processing & Properties supports conductivity and property conditions. Symbols, ratios, resistance and exponential-response notation are explained here; calculus is optional. All numerical materials, contacts, operating records, curves and limits are constructed teaching cases. Named physical constants retain their ordinary meanings. No equipment operating procedure is given.

Back to the chapter

After reading, you can

Use a thermal-resistance model while distinguishing conductivity, geometry and interface effects.

01

Heat rate differs from heat amount

Conduction transfers energy through matter without requiring bulk motion of the material. Heat flows down a temperature gradient. For a flat slab with constant conductivity k, area A and thickness L in steady one-dimensional conduction, the magnitude is Q̇=kA(Th−Tc)/L. Q̇ is a rate in watts, while energy transferred during a constant-rate interval is Q=Q̇t in joules.

Conductivity has units W/(m·K). It is a material property under stated temperature, direction and structural conditions, not a property of a whole assembled wall. The minus sign in the general gradient form Q̇=−kA dT/dx expresses flow toward decreasing T. For the simple slab, specifying hot and cold temperatures makes the direction explicit without calculus.

02

Add the relevant resistances

Define slab resistance R=L/(kA), measured in K/W, so Q̇=ΔT/R. Series layers carry the same steady heat rate when side losses and internal generation are absent. Their resistances add. Parallel paths share boundary temperature differences and their rates add; a conducting bridge can bypass an otherwise resistive layer.

Real contacts may have a temperature difference between the two nominal touching surfaces. An interface resistance Rc=ΔTcontact/Q̇ represents that unresolved contact behavior. Its value depends on surface and assembly conditions. It is different from a material conductivity. State whether a quoted resistance is for the complete component in K/W or normalised by area in m²·K/W.

03

Match the temperature boundary to the model

The plotted example uses specified solid-face temperatures, not distant air temperatures. If surrounding fluid temperatures are supplied instead, include convection between fluid and each face. A finite material with ongoing heat generation may have a curved temperature profile; the simple constant-rate layered model then needs revision.

A high conductivity layer can have a very small temperature drop even when another part of the same route has a large one. Adding insulation reduces heat transfer under fixed boundary temperatures. If a component generates a fixed power that must escape, increasing resistance can instead raise its temperature. The boundary condition decides which consequence the resistance change predicts.

Temperature drops reveal the dominant thermal resistanceA constructed steady wall temperature profile includes two layers and a contact drop at their interface.024681012020406080Distance through solid layers / mmTemperature / °CSolid: layers; dashed: idealised contact drop20 W throughout; no internal generation or side loss
For area0.02 m2, layer1 L10 mm,k0.2 W/(m K); layer2 L2 mm,k20. Contact resistance0.495 K/W. Surface temperatures80 and20 C give20 W. Temperature80 to30 C across first layer,30 to20.1 C at model contact,20.1 to20 C across second. Contact has no resolved geometric thickness.

Find the rate and each temperature drop

Use fictional layers of area0.02 m². R1=0.010/(0.2×0.02)=2.5 K/W and R2=0.002/(20×0.02)=0.005 K/W. Add a supplied contact resistance0.495 K/W to obtain Rtotal=3 K/W. With faces at 80 and 20 °C, Q̇=60/3=20 W.

The first-layer drop is 20×2.5=50 K, contact drop9.9 K and second-layer drop0.1 K. Temperatures are80,30,20.1 and 20 °C along the path. The vertical graph segment represents a contact model, not an invented finite-thickness layer. Over60 s at this steady rate,1200 J crosses each complete section.

Try the reasoning

  1. Does doubling slab thickness double its conductivity?

    Show the answer and reasoning

    No. It doubles slab resistance in this model; conductivity remains the stated material property.

  2. Why cannot distant air temperatures replace the specified face temperatures without another term?

    Show the answer and reasoning

    There can be temperature differences across the fluid-side convection layers. Their resistances must be included.

  3. Does adding insulation always lower the temperature of a heat-generating component?

    Show the answer and reasoning

    No. Under fixed generated power, greater escape resistance can raise the component temperature.

What to carry forward

Follow the whole heat path and its boundary conditions. Conductivity, component resistance and contact resistance are different descriptions.

References

Teaching resources and research supporting this lesson’s explanations and examples.

  1. Massachusetts Institute of Technology3 sources
    1. Thermodynamics and Propulsion — 16.3 Steady-State One-Dimensional ConductionE. M. Greitzer, Z. S. Spakovszky and I. A. Waitz; MIT Unified EngineeringTeaching resourceweb.mit.eduRead source
    2. Thermodynamics and Propulsion — 16.4 Thermal Resistance CircuitsE. M. Greitzer, Z. S. Spakovszky and I. A. Waitz; MIT Unified EngineeringTeaching resourceweb.mit.eduRead source
    3. Thermodynamics and Propulsion — 17.2 Combined Conduction and ConvectionE. M. Greitzer, Z. S. Spakovszky and I. A. Waitz; MIT Unified EngineeringTeaching resourceweb.mit.eduRead source
  2. Module2, Lecture5 — Thermal Contact ResistanceNPTEL, Heat Transfer web courseTeaching resourcearchive.nptel.ac.inRead source